Chongqing Chongyou Information Technology Co., Ltd. (CYIT) has recently rolled out the world?痵 first TD-SCDMA mobile phone chip using the 0.13 um process. Named the Tongxin I (General Chip I), the new product is a proprietary chip up to 3GPPTD-SCDMA standards with nicely designed structures and algorithms. Simulations and trial operations confirmed an extremely good performance and stability, capable for all applications needed at the physical level, or by protocols and TD-SCDMA mobile phone software. The chip is a multi-core single crystal wafer, made of the company?痵 proprietary circuits, ARM926 processor and ISI?痵 ZSP500 digital signal processor. Researchers also used SYNOPSYS chip making tools and technologies to improve the chip?痵 performance. The chip is manufactured by Semiconductor Manufacturing International Corporation, and packed by GAPT.
The new chip presents the following features and strength: 1) the world first TD-SCDMA handset chip using the 0.13 um process, with low power consumption, small internal cores, and a reduced cost; 2) a multi-core structure, containing 1 ARM and 2 DSPs, capable for high speed processing; 3) built-in testing, Viterbi, and Turbo for an enhanced speed to support all operations under 384 kilobit/s; and 4) IP core for steady and reliable performance, and for massive production as well.
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